摘要
The increasing power density of modern electronic devices necessitates advanced thermal management solutions capable of dissipating high heat loads while maintaining temperature uniformity. Vapor chambers (VCs) are effective heat spreaders for high-power applications, yet their coupled thermal-hydraulic behavior remains difficult to fully characterize. In this study, a three-dimensional numerical framework is developed to simultaneously couple heat transfer, fluid flow, and phase change in a high-power VC featuring hierarchical dendritic wick structures, supporting pillars, and sintered powder rings. To improve model fidelity, experimentally measured boiling heat transfer and capillary performance of the wick are directly incorporated, enabling realistic representation of evaporation-to-boiling transition and liquid replenishment. The model is validated against thermal performance experiments of an actual high-power VC over a wide range of heat loads, showing strong agreement and reliable predictive capability. Results demonstrate that the VC significantly outperforms a reference copper block by lowering heat source temperature and enhancing temperature uniformity, leading to reduced thermal resistance, particularly under high heat loads (>500 W) due to boiling-enhanced heat transfer. At 700 W, the VC decreases the heat source temperature by over 10( degrees)C compared to the copper block. A parametric analysis further indicates that sintered powder ring arrangement critically affects phase change area, vapor transport, and liquid replenishment, with a periphery ring configuration yielding an additional 8% reduction in thermal resistance. These findings provide practical design guidelines for optimizing high-power VCs in advanced electronic cooling applications.