Abstract
The rapid development of soft materials in recent years gives revolutionary impact on electronics and biomedical industries. To better control the quality and key technology, mechanical properties of soft materials employed in electronics and biomedical industries must be accurately determined. By employing the non-destructive, non-contact and whole-field characteristics of the three-dimensional (3D) digital image correlation (DIC) method, mechanical properties of three kinds soft materials, i.e. epoxy resin used in photoviscoelasticity, optical films used in backlight modules of the thin film transistor liquid display (TFT-LCD) and artificial meshes used in biomedical applications were investigated in this paper. It was found that satisfactory accuracy and measurement range can be obtained from the 3D-DIC method on the measurement of mechanical properties of soft materials.