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Time-dependent drain- and source-series resistance of high-voltage lateral diffused metal-oxide-semiconductor field-effect transistors during hot-carrier stress
Journal article   Peer reviewed

Time-dependent drain- and source-series resistance of high-voltage lateral diffused metal-oxide-semiconductor field-effect transistors during hot-carrier stress

Shih-Hui Chen, Jeng Gong, Meng-Chyi Wu, Tsung-Yi Huang, Jei-Feng Huang, Ruey-Hsin Liou, Shun-Lang Hsu, Li-Ling Lee and Hung-Chun Lee
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, Vol.42(2 A), pp.409-413
02/2003

Abstract

Degradation High voltage Hot carrier LDMOSFET Series resistance Transconductance
In this paper, a new reverse transconductance method for investigating the effect of hot-carrier degradation on high-voltage (HV) lateral diffused metal-oxide-semiconductor field-effect transistors (LDMOSFETs) is presented. This new method can extract asymmetric drain and source series resistance separately with only one single device. By using this extraction method in HV LDMOSFETs before and after the application of hot-carrier stress, drain series resistance is extracted and found to increase while source series resistance remains the same. In addition, the threshold voltage and subthreshold slope suffer no degradation after the application of hot-carrier stress. Therefore, it is suggested that the current degradation in HV LDMOSFETs after the application of hot-carrier stress is not due to the damage under the channel but is due to the drift region under the spacer oxide. This is confirmed by the simulation results of a two-dimensional (2D) simulator. In addition, the differences in hot-carrier degradation between HV LDMOSFETs and low-voltage lightly doped drain (LV LDD) MOSFETs are also discussed in detail.

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