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Using silica nanoparticles as curing reagents for epoxy resins to form epoxy-silica nanocomposites
Journal article   Peer reviewed

Using silica nanoparticles as curing reagents for epoxy resins to form epoxy-silica nanocomposites

Ying-Ling Liu and Shu-Hsien Li
Journal of Applied Polymer Science, Vol.95(5), pp.1237-1245
05/03/2005

Abstract

Curing of polymers Epoxy Nanocomposites Nanoparticles Silicas
Nanoscale colloidal silica showed high reactivity toward curing epoxy resins to form epoxy-silica nanocomposites under mild conditions. Adding a certain amount (5000 ppm) of magnesium chloride lowered the activation energy of the reaction from 71 to 46 kJ/mol. Less and more magnesium chloride both exhibited counter action on lowering the activation energy of the curing reaction. Tin chloride dihydrate and zinc acetylacetonate hydrate were also added into the curing compositions, however, showing no significant effect on promoting the curing reaction. Through this curing reaction, epoxy-silica nanocomposites containing high silica contents up to 70 wt % were obtained. Therefore, this reaction provided a novel and convenient route in preparation of epoxy-silica nanocomposites. © 2005 Wiley Periodicals, Inc.

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