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Waste solder and printed circuit board: The emerging secondary sources for recovery of metals
Journal article   Peer reviewed

Waste solder and printed circuit board: The emerging secondary sources for recovery of metals

U.U. Jadhav and H. Hocheng
Archives of Materials Science and Engineering, Vol.72(1), pp.5-15
01/03/2015

Abstract

Bio-hydrometallurgy Electronic waste Hydrometallurgy Metal recovery Printed circuit board Pyrometallurgy Solder
Purpose: Purpose: The goal of the paper is to focus on waste solder and printed circuit board: the emerging secondary sources for recovery of metals Design/methodology/approach: The worldwide reserves of high-grade ores are diminishing. At the same time the demand for heavy metals is ever increasing with the progress of the industrialized world. The rapid progress of electronic packaging technology is resulting in huge amounts of electronic waste (E-Waste) particularly in the form of solders and printed circuit boards (PCBs). Such E-waste contains various metals. The waste solders and PCB can act as large stockpiles of metals. Hence, they can be important secondary sources of valuable metals. Thus recycling of waste solders and PCB is not only useful for resource recovery from waste materials, but also for the protection of the environment. Findings: Comparing with the pyrometallurgical processing, hydrometallurgical method is more exact, more predictable, and more easily controlled. Bio-hydrometallurgical processes are emerging as potential environmentally friendly approaches Research limitations/implications: Several promising metal recovery processes were developed to recover the precious metals from E-waste. There is a need to fill the gap areas in achieving a cleaner and economical recycling process. Also more studies are needed in the area of metal separation and recovery from PCB leach liquor. Orginality/Value: This review article will provide a concise overview of current disposal and recycling operations. © International OCSCO World Press. All rights reserved. 2015.

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