Warpage Modeling of Ultra-Thin Packages Based on Chemical Shrinkage and Cure-Dependent Viscoelasticity of Molded Underfill

Magazine article

Peer reviewed

Po Yao Lin and Sanboh Lee

IEEE transactions on device and materials reliability, Vol.20(1), pp.67-73

01/03/2020

Abstract

chemical shrinkage

finite element method

Ultra-thin package

viscoelasticity

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Title: Warpage Modeling of Ultra-Thin Packages Based on Chemical Shrinkage and Cure-Dependent Viscoelasticity of Molded Underfill
Creators: Po Yao Lin - National Tsing Hua University
Sanboh Lee - National Tsing Hua University
Number of pages: 7
Grant note: Ministry of Science and Technology, Taiwan (http://data.elsevier.com/vocabulary/SciValFunders/501100004663)
Resource Type: Magazine article
Date published: 01/03/2020
Publication Details: IEEE transactions on device and materials reliability, Vol.20(1), pp.67-73
Language: English