Abstract
The structure has a through hole (306) formed in a filling area that is formed at an electronic element (301). A leading material is filled in the hole to form a signal connection between an upper surface of the filling area and a supporting substrate (320). A signal contact (325) is formed on a side of the structure. An upper surface area of the contact is large, small or equal to the electronic element. The contact is formed on the side of the structure, where the side is connected with the contact to form a canal between the contact and an inner switching circuit of the electronic element.