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Heat Dissipating Apparatus Having Micro-Structure Layer And Method Of Fabricating The Same
Patent

Heat Dissipating Apparatus Having Micro-Structure Layer And Method Of Fabricating The Same

Industrial Technology Research Institute, 陳紹文, Shyu, Jin-Cherng, Tsai, Ming-Jye, Yeh, Lan-Kai and Lin, Che-Wei
11/01/2006

Abstract

The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

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