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Method And Apparatus For Atomic Layer Deposition Using Multiple Chambers
專利

Method And Apparatus For Atomic Layer Deposition Using Multiple Chambers

National Tsing Hua University, Po-Wen Chiu 和 Jui-Kang Yen
12/02/2026

摘要

A method for implementing a thin film deposition process includes: transporting a substrate into a first chamber; feeding a precursor into the first chamber, the precursor being adsorbed on a top surface of the substrate; supplying radiant energy to at least a part of the top surface of the substrate to facilitate reaction between the precursor and the top surface of the substrate; transporting the substrate with the top surface being precursor-adsorbed into a second chamber that is separated from the first chamber and that is spatially isolated from the first chamber; feeding a reactant into the second chamber, wherein reaction between the reactant and the precursor results in a thin film forming on the top surface.

相關連結

指標

1 檢視次數

詳細資料

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