Logo image
Method for Testing Through-Silicon-Via and the Circuit Thereof
Patent

Method for Testing Through-Silicon-Via and the Circuit Thereof

誠文 吳 and 誠文 吳
10/09/2013

Abstract

The method and circuit for testing a TSV of the present invention exploit the electronic property of the TSV under test. The TSV under test is first reset to a first state, and is then sensed at only one end to determine whether the TSV under test follows the behavior of a normal TSV, wherein the reset and sense steps are performed at only one end of the TSV under test. If the TSV under test does not follow the behavior of a normal TSV, the TSV under test is determined faulty.

Metrics

1 Record Views

Details

Logo image