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Micro-Electro-Mechanical Device Having Low Thermal Expansion Difference
Patent

Micro-Electro-Mechanical Device Having Low Thermal Expansion Difference

Tsai, Ming-Han, Fang, Wei-Leun, Liu, Yu-Chia, 方維倫, Liu, Yu-Chia and Tsai, Ming-Han
28/05/2014

Abstract

The invention provides a micro-electro-mechanical device which is manufactured by a CMOS manufacturing process. The micro-electro-mechanical device includes a stationary unit, a movable unit, and a connecting member. The stationary unit includes a first capacitive sensing region and a fixed structure region. The movable unit includes a second capacitive sensing region and a proof mass, wherein the first capacitive sensing region and the second capacitive sensing region form a capacitor, and the proof mass region consists of a single material. The connecting member is for connecting the movable unit in a way to allow a relative movement of the movable unit with respect to the stationary unit.

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