Abstract
The invention discloses a micro-structure capacitor formed by joining the metal layer of a multi-porous micro-structure. A substrate is used as an etching stop layer when producing the capacitor. Therefore, pores with low aspect ratio and uniform size are formed on the surface of the substrate. The efficiency of the subsequent thin film coating process is increased. The porous three-dimensional structure increases the capacitance. Micro-structures are stacked up so the capacitor produced features small size and high capacitance.