- Title
- Packaging Structures for Electronic elements and Solid Electrolytic Capacitor Elements and Methods thereof
- Creators - without role
- 曹哲之
- Identifiers
- 9957787750206774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Patent
- Patent
- US 12,057,274; US 12,057,274
- Date application
- 09/02/2022
Patent
Packaging Structures for Electronic elements and Solid Electrolytic Capacitor Elements and Methods thereof
06/08/2024
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