摘要
A planar inductor of the disclosure includes a first substrate, a second substrate, a plurality of strip conductors, a plurality of second strip conductors, a first planarization layer, a second planarization layer, a first magnetic layer, at least one first bonding pad and at least one second bonding pad. The first planarization layer covers the first strip conductors disposed on the first substrate. The second planarization layer covers the second strip conductors disposed on the second substrate. The first magnetic layer is disposed on the first planarization layer. The at least one first bonding pad is disposed on the first substrate. The at least one second bonding pad is disposed on the second substrate. The at least one first bonding pad is used to electrically bond with the at least one second bonding pad, enabling electrical conduction between the first strip conductors and the second strip conductors.