Abstract
A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.