Abstract
An integrated lead suspension (ILS) has a constrained layer damper (CLD) that attenuates vibration of the ILS. The CLD may be applied over an already assembled ILS such that the CLD is applied to the cover layer, to the base layer, or to both. Alternatively, the ILS may be encapsulated via a deposition process such that a damping layer is sandwiched between the conductor layer and the cover layer of the ILS, between the conductor layer and the dielectric layer of the ILS, or both.