Abstract
A three-dimensional selective repairing system, which is for selectively repairing an area of an unrepaired element by sintering, includes a scanning device, a comparing device, a spraying device and a sintering device. The scanning device is for scanning the area to obtain a repairing data. The comparing device is connected to the scanning device to receive the repairing data and produce a repairing parameter. The spraying device is controlled by the repairing parameter and includes an electrostatic generator which sprays a plurality of electrified pulverulent bodies through the electrostatic generator to form an electrified pulverulent film on a medium covered on the area. The sintering device is controlled by the repairing parameter to provide a power beam to selectively heat the electrified pulverulent film. The electrified pulverulent film melted or sintered to form a solid mass on the area.