Abstract
PROBLEM TO BE SOLVED: To provide a method for manufacturing a probe card which has a high probe density, a high contact stability with an electric circuit during testing, which can test a wafer, which can execute a large deformation of the probe, and which can rapidly test in a high frequency and to provide the probe card. SOLUTION: The method for manufacturing the probe card comprises the steps of molding recesses of a cantilever space and a needle head space on a base material, embedding the recesses by an electric casting and molding a cantilever 34 and a needle head 32. The method further comprises the steps of coating a photoresist having a through recess as a sacrificial layer, and covering the photoresist with a base plate 60. The method also comprises the steps of providing a base space communicating with the through recess on the plate 60, molding a probe base 70, and removing the base material and the photoresist. A bottom of the base 70 is projected from the plate 60, flexibly deformed by incorporating the space for the photoresist, and hence a distance between the head 32 and the bottom of the plate 60 can be changed.