Abstract
The present invention discloses a method for manufacturing a three-dimensional microstructure, which adopts a semiconductor manufacturing process using thick film photoresist to form a multi-layer stacked microstructure on a substrate. By controlling the dosage of exposure and using an anti-reflection layer to absorb the light of exposure, an embedded micro-channel can be formed inside the thick film photoresist. By repeating the same process, multiple layers of microstructures can be stacked and the micro channels of the upper and lower layers can be connected to form a three-dimension channel.