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三維微電極結構及其組裝方法
Patent

三維微電極結構及其組裝方法

國立清華大學, 李侑道, 張兗君 and 方維倫
15/04/2011

Abstract

This invention provides a method for assembling a three dimensional micro electrode. The method comprises the steps of: forming a three dimensional micro electrode array by stacking two dimensional micro electrode arrays through an auxiliary tool; and then assembling a carrying chip. The three dimensional micro electrode structure is then produced. By aligning the correction portion of the two dimensional micro electrode with the carrying chip, the design flexibility for the probe is increased. This invention further provides a structure of three dimensional electrode manufactured by the above method. Therefore, electric signals of biological tissue can be detected in a three dimensional manner.

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