Abstract
The present invention discloses a 3D-IC differential sensing and charge sharing scheme which includes a plurality of TSVs including a first TSV and a second TSV. A tracking circuit is coupled to the first TSV. A sensing circuit is coupled to the second TSV and the tracking circuit. A plurality of equaling circuits are provided and wherein each of equaling circuit is configured and electrically connected between adjacent two equaling circuits. A clamping circuit is coupled to the first TSV.