Abstract
A low thermal stress and high sensitivity silicon base micro pressure sensor structure is proposed in this invention. This invention flips the micro sensor and using the conductive bumps to connect the electrode of the sensor and the flex circuit board. The structure in this invention replace the conventional wire bonding interconnected process and the flex circuit board can be acted as a stress buffer to reduce the residual stress and signal error from the thermal mismatch. Compare with the conventional package of the silicon base pressure sensor, this invention could be packaged without protective gel. Moreover, after insulating process the micro sensor can be placed in the fluid.