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使用高附着性触媒的无硅烷无电镀金属沉积方法及生成物
Patent

使用高附着性触媒的无硅烷无电镀金属沉积方法及生成物

衛子健, 王偉彥, 許晉偉 and 衛子健
13/10/2017

Abstract

A method for no-silane electroless plating of metal using high adhesive catalyst includes: (a) providing a substrate, and the substrate having a surface which is subjected a surface modification to form a layer of hydrophilic wet chemical oxide; (b) forming a catalyst layer on the layer of hydrophilic wet chemical oxide, the catalyst layer including a plurality of colloid nanoparticles, and each of the colloid nanoparticles including a palladium nanoparticle and a palladium nanoparticle wrapped polyvinyl alcohol polymer; and (c) conducting the electroless plating of metal, and the metal being deposited on the catalyst layer to form an electroless plating metal layer. A substrate including no-silane electroless plating metal layer is also provided.

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