Abstract
The method for making optical microelectromechanical component includes the following steps: providing a substrate, depositing an oxide layer on said substrate, making multiple etching on said substrate to form trench with several depths, depositing first polycrystalline silicon layer for back-filling said trench, depositing first nitride layer and second polycrystalline silicon layer on said back-filled trench, removing said first polycrystalline silicon layer, depositing second nitride layer and making bulk etching.