Abstract
A new electronic packaging structure, which could enhance the long time reliability in working state, would be proposed in this invention. This invention comprises substrate, and one or plural bump structures on the said substrate. Besides, the height of said bump structure could be equal to or differ from each other bump. The electronic packaging structure also comprises one or plural conductive film, which cover the said bump structure. One electronic device, located above the conductive film, has one or plural electronic connective devices on the surface of said electronic devices. The said electronic connective devices are located opposite to the said bump structures. After assembling the said electronic device to the said structure, the electronic signal connection between said electronic device and said substrate is established by the said conductive film. The bump structure could effectively release the mechanic mechanism of the thermal expansion coefficient mismatch between the electronic device and substrate, and increase the reliability of the electronic packaging structure.