Abstract
This invention provides one kind of the 3D electronic packaging structure using conductive substrate. The packaging structure can be stacked thought the contact pads at the top and bottom surfaces. The packaging units could be fabricated as the wafer-level-packaging and reduce the fabrication cost. Electronic signals from the electronic components can pass thought the patterned conductive base in packaging structure. The patterned conductive base can also be connected to the ground signal of the electronic components and enhance the electronic performance of the packaging. Due to the high thermal conductivity feature of the conductive base, heat generation of the electronic components can be transferred thought the base of packaging to atmosphere and the packaging reliability could be reinforced.