Abstract
A heat dissipation apparatus with a microstructure layer and a manufacture method are to prepare two high heat conduction substrates with structural patterns first. High heat conduction materials are then injected into the structural patterns respectively via injection molding. A microstructure layer is then formed on the structural patterns. After the microstructure is combined with two high heat conduction substrates, the heat dissipation apparatus with the microstructure layer is then made. The heat dissipation apparatus includes a substrate body combined from two high heat conduction substrates and a space existed in the substrate body. An interior wall of the space has the microstructure made by injection molding. The space is filled with a working fluid. Therefore, shortcomings for the precision of the microstructure layer and high heat conductivity in the prior art can be overcome through the technique.