Abstract
This invention provides an electric apparatus with multi-chip stacked package and the method of forming said apparatus. There is installed a stacked chip on the substrate. A lower chip is connected on the substrate through bumps. An upper chip is connected on the substrate through bonding wire. An encapsulation layer is used to cover the chip and the bonding wire. There is further provided a conductor between the stacked chips to provide an enhanced heat dissipation effect, and also to be electrically connected to the same power source or grounding terminal, thereby isolating the electro-magnetic interference (EMI) and the cross interference between signals.