Abstract
In accordance with the present invention, a substrate having a thermal expansion coefficient matched with the thermal expansion coefficient of the chip is used as a back plate placed at the bottom for dissipating heat and supporting. Then, a metal lead frame is placed at the central layer, and a flip chip is placed thereon, thereby completing the package of a flip chip in a sandwich manner. Such a product has the effects of being easily manufactured, good heat dissipation, good planarization, and being advantageous to multi-chip package. The present invention is particularly suitable to the mass production of the dual-in-line package. The present invention can also be applied to the mass production of the quad-in-line package.