Abstract
This invention provides one kind of electronic packaging structure which contains the enhanced design. The enhancement design is fabricated through batch process. The purposes of the enhanced design are decreasing the thermo-mechanical stress due to the coefficient of thermal expansion (CTE) mismatch among packaging material and improving the packaging reliability. In the above packaging structure, the electric signal could be connected to the enhanced design, and thus the electric performance of the package is increased because of the provided ground plane. On the other hand, the accumulated heat from the integrated circuit could be dissipated quickly through the enhanced design. Therefore, the proposed invention is especially suit for integrated circuits with high power density.