Abstract
A semiconductor device includes a nitride-based transistor, a first metal layer, a second metal layer, a third metal layer, a source pad, and a drain pad. The first metal layer is disposed over the nitride-based transistor. The second metal layer is disposed over the first metal layer. The third metal layer is disposed over the second metal layer and includes a first pattern and a second pattern spaced apart from each other. The source pad is immediately above the first pattern of the first metal layer, the second metal layer, and the third metal layer, and is electrically coupled with the nitride-based transistor. The drain pad is immediately above the second pattern of the first metal layer, the second metal layer, and the third metal layer, and is electrically coupled with the nitride-based transistor.