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半导体装置及其制造方法
Patent

半导体装置及其制造方法

英诺赛科(珠海)科技有限公司 and 黃敬源
30/07/2019

Abstract

The invention provides a semiconductor device and a production method thereof. The semiconductor device comprises a substrate, a doped III-V family layer, a conductor structure and a metal layer, wherein the doped III-V family layer is arranged on the substrate; the conductor structure is arranged on the doped III-V family layer; and the metal layer is arranged between the conductor structure andthe doped III-V family layer.

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