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半导体装置及其制造方法
Patent

半导体装置及其制造方法

英诺赛科(珠海)科技有限公司, 黃敬源 and 李启珍
09/12/2021

Abstract

A semiconductor apparatus, comprising a semiconductor layer (11), a first doped nitride semiconductor layer arranged on the semiconductor layer (11), a second doped nitride semiconductor layer arranged on the first doped nitride semiconductor layer, and an undoped nitride semiconductor layer (12) located between the semiconductor layer (11) and the first doped nitride semiconductor layer, wherein the undoped nitride semiconductor layer (12) has a first surface that is in contact with the semiconductor layer (11) and a second surface that is in contact with the first doped nitride semiconductor layer.

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