Abstract
A semiconductor includes a substrate, a first chip, an electrically conductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the substrate. The electrically conductive adhesive is disposed on the upper surface of the first chip. The second chip has an upper surface and a lower surface opposite to the upper surface, wherein the lower surface is mounted on the upper surface of the first chip by means of the electrically conductive adhesive, and the adhesive measured area between the electrically conductive adhesive and the second chip is 90% larger than the measured area of the lower surface of the second chip. The plurality of supporting balls are disposed in the electrically conductive adhesive for supporting the second chip.