Abstract
A stacked electronic packaging structure with packaging units, which could both reduce the mounting area and increase the high density assemblies of devices to satisfy the requirement of diminishing the volume of packaging structure and reducing the transmissive time and the path of electronic signals among devices to increase the operated efficiency, would be proposed in this invention. In additions, this proposed packaging structure composed of one or plural packaging units could be designed and stacked by depending on the applied environment and the functional demand of electronic products. Furthermore, the various packaging units could be batch-manufactured by using current semiconductor technologies, and then the plural bonding structures are used to connect the packaging units to form the stacked structure. Therefore, the microelectronic devices within each packaging units could be electrically conducted both the adjacent packaging units and the substrate.