Abstract
The present skill relates to a kind of micro ball grid array multi-chip 3-D package, in which the conventional micro ball grid array package having only one single chip is redesigned. One of the carried out examples is to provide heat dissipation, layout, and support function for the back plate so as to obtain the micro ball grid array multi-chip 3-dimentional package. In the present skill, chip circuit is connected to the circuit on the ceramic plate. Circuit on the ceramic plate is extended to the peripheral input/output pad and is coupled to the printed circuit board base material by using the input/output pad. The ball grid array on the backside of the printed circuit board material is used as the extended input/output terminal of the entire package so as to complete the micro ball grid array multi-chip 3-dimentional package of the present skill.