Abstract
This invention provides one kind of the photoelectric device structure with multi-layer thermal dispersion plate. The photoelectric device structure can achieve the goal of thermal dispersion rapidly by the multi-layer thermal dispersion plate. The multi-layer thermal dispersion plate can be connected through the fixed mechanism which in the photoelectric device structure. The thermal dispersion plate can have the openings and the openings not only make the thermal dispersion via through the multi-layer thermal dispersion plate but also connect the photoelectric element with the thermal dispersion plate. On the side, the heat insulation materials are existed between the thermal dispersion plates to make the thermal conductive effect can not influence each other. By this structure, the heat which produced by photoelectric device can be banish rapidly through the via to plate. Beside, through the thermal insulation materials can obtain the efficacy of thermal dispersion in each plate. By this method, the performance of the photoelectric device structure can be enhanced.