Abstract
The present skill relates to a stacked MCM micro ball grid array package, which re-designs the conventional single-chip micro ball grid array package to obtain a stacked MCM micro ball grid array package. In accordance with the present skill, the four sides of the chip are designed to have a local area without I/O terminals, so as to enhance the yield of the assembled product and disclose a novel stacked MCM micro ball grid array package. In accordance with the present skill, it is also applicable to install heat dissipation material into the product for increasing the heat dissipation effect, electrical performance, and product reliability. Furthermore, an encapsulation process can be performed to enhance the reliability of the product.