Abstract
A three-dimensional stacking packaging structure and the method thereof are disclosed. The structure includes a main substrate having at least one set of plug holes; at least one flexible substrate having at least one set of plug legs corresponding to the plug holes and having at least one set of electronic wires electrically connecting to the plug legs; and at least one electronic device, an electronic active or passive device, mounted on each of the flexible substrate. The plug legs on the flexible substrate could insert into the plug holes while assembling the electronic packaging structure. Through the electronic wires, plug legs, and plug holes, the electronic connection between the electronic device and main substrate could be accomplished.