Abstract
The present invention provides a flat MCM uBGA (micro ball grid array) package wherein the well-known single-chip uBGA is redesigned to make a flat MCM uBGA package. The four edges of the chip is designed to have no input/output terminals on one or two edges in the present invention, so that the edges without the input/output terminals can be merged together, which not only increases the yield rate of the merged product, but also completes the flat MCM uBGA package. A heat dissipation plate can also be merged into the product of the present invention, so that the heat dissipation effect, electrical characteristics and reliability of the product can be enhanced.