Abstract
The invention relates to a kind of micro-ball grid array multi-chip three-dimension (3-D) package. In the invention, the conventional single-chip micro-ball grid array package is redesigned such that heat dissipation, layout, and support functions are provided for the back-board to complete micro-ball grid array multi-chip 3-D package. In the invention, a chip circuit is connected with the circuit on the ceramic plate. The circuit on the ceramic plate is extended to the peripheral input/output pad, which is then connected with the printed circuit substrate. By using the ball grid array on the backside of printed circuit substrate as the extended input/output terminal point of the entire package, the invented micro-ball grid array multi-chip 3-D package is completed.