Abstract
The present invention discloses an enhanced structure of heat transfer for flat-plate type heat pipe, in which the evaporating end of heat pipe is connected with the heating device, and the cooling end is connected with the heat-dissipation device. There is a capillary structure on the surface inside the cavity of heat pipe, and it is stuffed with properly operational fluid inside the cavity of heat pipe, the evaporating/cooling cycle of working fluid is proceeded inside the cavity of heat pipe. Plural heat-conduction pillars abutted against the upper/lower wall are disposed at the position in the cavity with higher temperature as the enhanced structure of heat transfer. Through the design of heat-conduction pillar, it can reduce the heat-resistance along the heat transfer path, and achieve the goal of good heat dissipation and heat uniformity.