Abstract
The invention relates to a <mu>BGA flat MCM micro electronics package, which redesigns the conventional <mu>BGA package, that can package a single chip only, to use a ceramic plate as a back-plate to provide the functions of heat-dissipation, wire layout, and the supporting, thereby accomplishing the <mu>BGA flat MCM micro electronics package. The invention is provided to couple the chip circuit to the circuit on the ceramic plate. The circuit on the ceramic plate extends to the peripheral of the plate and couples to the substrate of the printed circuit board (PCB). The BGA on the backside of the substrate of the printed circuit board is used as the extending input and output terminals of the whole package to complete the <mu>BGA flat MCM micro electronics package in accordance with the present invention. The invention can also be used in packaging a single chip for increasing the robustness of the single-chipe package and the efficiency of heat-dissipation.