Abstract
The present art is a flat multi-chip microelectronic package, which redesigns the conventional micro ball grid array package and provides a ceramic plate used as a back plate for providing the heat dissipation, layout and support functions, thereby achieving a flat multi-chip microelectronic package. In the present art, the chip circuit is coupled to the circuit on the ceramic plate. The circuit on the ceramic plate is extended to the I/O pads on the periphery, and is coupled to the printed circuit substrate. The I/O terminals of the printed circuit substrate are used as the extended I/O terminals of the whole package, thereby completing the present flat multi-chip microelectronic package. The present art can be applied to a single chip package to increase the durability and enhance the heat dissipation function for the single chip package.