Abstract
This invention provides one kind of the 3D electronic packaging structure with enhanced grounding performance and embedded antenna. The packaging structure can be stacked thought the contact pads at the top and bottom surfaces. The grounding layers were fabricated at the bottom surface of the silicon wafer and facilitated the grounding for integrated circuit. Moreover, the packaging units could be fabricated as the wafer-level-packaging and reduce the fabrication cost. The signals from the packaged integrated circuits could also be carried by the patterned grounding layers. By using the through hole surrounding the integrated circuits, the electronic signals at the top and the bottom surfaces of the packaging can communicate. Therefore, the applications of the electronic packaging structure are improved. Besides, the interconnects formed in the grounding layers could have circular shape. By this method, the antenna can be embedded inside our electronic packaging structure with enhanced grounding performance.