Abstract
A micro-connector and manufacturing method thereof are provided. The micro-connector includes a patterned first silicon-layer, a patterned insulator, at least a first stress-layer, at least a second stress-layer, and a cap. The patterned silicon-layer has a first opening. The patterned insulator has a second opening corresponding to the first opening and at least a cantilever-terminal, wherein the cantilever-terminal is protruded above the first opening. The first stress-layer is formed on an end of the cantilever-terminal away an inside wall of the second opening, and makes the end toward a direction. The second stress-layer is formed on portion of the cantilever-terminal out of the end, and makes the cantilever-terminal bend toward another direction. The cap is disposed on the patterned insulator and covers the cantilever-terminal.