Abstract
An integration manufacturing process for a MEMS element is provided. The integration manufacturing process includes steps of (a) manufacturing a cover having a cavity, (b) providing a substrate, (c) locating a plurality of micro-structures onto the substrate, (d) locating a conducting device onto the substrate for controlling the plurality of micro-structures, and (e) forming the MEMS element by assembling the cover with the substrate in a vacuum. The plurality of micro-structures include a testing element, and the testing element would be contained in the cavity after the MEMS element is formed.