Abstract
This invention relates to a method of packaging micro-fluid chips and chips thereof. The method comprises the following steps: preparing a substrate and a thin film, wherein the substrate at least has two slits and micro-channel connecting the two slits, and the thin film is made of the co-pressing process of polyethylene (PE) and a polymer adhesive, said adhesive may be ethylene vinyl acetate copolymer (EVA resin); then adhering the film by the side of ethylene vinyl acetate copolymer to the substrate by the side having the micro-channel so as to enable fluid to flow from one slit of the substrate to the other via the micro-channel.