Abstract
A manufacturing method and its product of microstructure probe card are disclosed. The manufacturing method comprises: providing a substrate; etching a long groove-like cantilever space and a probe head space with one end recessed from the bottom space of the cantilever on certain positions of the substrate; electro-forming the cantilever and the probe head in the cantilever space and probe space; coating photoresist on the top surface of the substrate, and etching through the portion of photoresist corresponding to the portion of each cantilever away from one end of the probe head to form a void by photolithography; passivating an insulating seat plate on top of the photoresist, and forming a base space through the seat plate and connected to the cantilever by photolithography; electro-forming a probe base in the base space; removing the substrate and photoresist. The probe card manufactured by this method has the advantages of high probe density, and good contact, and is able to be applied for high-speed test.