Abstract
This investigation is providing a manufacturing method of Fan-out muti-chip stacking assembly structure, to set stacking chips on substrate and bottom chip is connected with substrate by metal bumping and top chip is connected by wire process on substrate, and then using epoxy compound to cover it and protect chips/devices and wires. Proceeding through mold via and filling contactor material in the via, we could transfer connecting function from substrate surface to epoxy compound surface and through I/O process, it could complete fan-out muti-chips stacking assembly structure.